Layanan ebook yang disediakan oleh Perpustakaan Universitas Gunadarma
Judul: | : | Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging |
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ISBN: | : | 9781315305875 |
Bahasa: | : | Inggris |
DDC: | : | |
Kepengarangan: | : | Xing-Chang Wei |
Edisi: | : | |
Tempat Terbit: | : | Boca Raton |
Penerbit: | : | CRC Press, Taylor & Francis Group |
Tahun Terbit: | : | 2017 |
Luas Bahan: | : | xviii + 322 hlm. |
Ilustrasi: | : | |
Dimensi: | : | |
Seri: | : | |
Catatan: | : | |
Bibliografis: | : | |
Keyword: | : | Printed circuits, Design and construction, Electronic packaging, Electromagnetic compatibility |