EBOOK

Layanan ebook yang disediakan oleh Perpustakaan Universitas Gunadarma

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging

Judul::Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging
ISBN::9781315305875
Bahasa::Inggris
DDC::
Kepengarangan::Xing-Chang Wei
Edisi::
Tempat Terbit::Boca Raton
Penerbit::CRC Press, Taylor & Francis Group
Tahun Terbit::2017
Luas Bahan::xviii + 322 hlm.
Ilustrasi::
Dimensi::
Seri::
Catatan::
Bibliografis::
Keyword::Printed circuits, Design and construction, Electronic packaging, Electromagnetic compatibility